Tungsten copper has unique material properties.
Copper tungsten thermal properties.
Tungsten copper combines many typical characteristics of the single elements tungsten and copper as for example the hardness wear and burn off resistance of tungs ten together with the good electrical and thermal conductivity of copper.
Copper infiltrated tungsten boasts such properties as high resistance to high temperature and arc erosion excellent thermal and electrical conductivity and a low cte coefficient of thermal.
The high thermal conductivity of copper together with the low thermal expansion of tungsten allows thermal expansion matching to silicon gallium arsenide and some ceramics.
Engineering thermal properties of metals conductivity thermal expansion specific heat data metals in general have high electrical conductivity high thermal conductivity and high density.
Consisting of pure tungsten w powder suspended in a matrix of copper cu these alloys are readily machinable and known for good thermal and electrical conductivity low thermal expansion being non magnetic good performance under vacuum and resistance to erosion from arcing.
Thus they are often used as electrical contacts particularly in high voltage applications.
Tungsten copper alloy is also called copper tungsten alloy consists of w and cu owns properties of heat resistant high density low thermal expansivity and high electrical conductivity which has been widely used as electrode contacts and heat sink materials.
Very good thermal conductivity.
By adjusting the content of tungsten we can have its coefficient of thermal expansion cte designed to match those of materials such as ceramics al2o3 beo semiconductors si and metals kovar etc.
Copper tungsten or wcu alloy also known as trade names elkonite is a composite matrix of tungsten and copper which combines the excellent properties of the elements such as heat resistance ablation resistance low thermal expansion and excellent thermal and electrical conductivity.
The physical and mechanical properties and melting point of tungsten copper material will be positively or oppositely affected by varying the amount of.
Tungsten copper heat sinks they are composites of tungsten and copper.
The cuw75 composite with 75 tungsten is widely used in chip carriers substrates flanges and frames for power semiconductor devices.
Table 4 and fig.
Typically they are malleable and ductile deforming under stress without cleaving.